● Fanless design supporting 0ºC ~ 50ºC operating temperature
● SIM card support 3G/LTE wireless connection
● Support IPMI 2.0 via iRIS-2400 module
产品特点
产品规格
订购信息
附件栏
产品特点
产品规格
订购信息
附件栏
产品特点
产品规格
订购信息
附件栏
产品特点
产品规格
订购信息
附件栏
● High Definition AMD® R-series APU
● Four independent HDMI display video outputs
● Fanless design supporting 0ºC ~ 50ºC operating temperature
● SIM card support 3G/LTE wireless connection
● Support IPMI 2.0 via iRIS-2400 module
Spec Item
Description
Color
Color
Black
Dimensions
Dimensions
251 x 173.35 x 57
Environment
Humidity
10% ~ 90%, non-condensing
Operating Temperature
0°C ~ 50°C with air flow
Expansion Slots
Expansion Slots
PCIe Mini:1 x Full size (supports mSATA), 1 x Half size
Form factor
SBC Form Factor
CPU:AMD® R-series R-260H 2.1 GHz
Chipset:AMD® A70M
System Memory:
2 x 204-pin DDR3 SO-DIMM (4GB pre-installed)(system max: 16GB)
I/O Interface
I/O Ports
2 x USB 3.0
2 x USB 2.0
Ethernet:
2 x RJ-45
1 x PCIe GbE by Intel® I210
1 x PCIe GbE by Intel® I211
RS-232:1 x RJ-45
Display:4 x HDMI
Resolution:1920 x 1080@60Hz
Audio:1 x Line-out, 1 x S/PDIF
Other:1 x SIM standard card slot
Wireless:802.1b/g/n 2T2R (optional)
System
Cooling method / System Fan
Fanless
Drive Bays
1 x 2.5' SATA 6Gb/s HDD/SSD drive bay
Weight
Weight
5.24 kg/6.5 kg
Item No.
Description
IDS-200-A70Mi/4G-R10
Fanless embedded system, AMD APU Dual Core R260H 2.1 GHz, TDP 17W, 4GB DDR3 SO-DIMM (2 x 2GB) pre-installed, 4 x HDMI, iRIS-2400 optional, 10~30V DC input, R10, RoHS